XEIA3 model 2016
Extraordinary ultra-high resolution imaging and extreme micromachining power in one single instrument. Whether your applications demand extremely powerful and ultra-fast micro-/nano- FIB machining, an ultimate uncompromised ultra-high resolution (UHR) at low beam energies, ultra-fast and reliable microanalysis or 3D analytical reconstructions, XEIA3 model 2016 stands out as the ideal turnkey FIB-SEM system that offers all these capabilities in one single and unique instrument with outstanding performance. With the new XEIA3 model 2016, TESCAN not only delivers an instrument top of its class but also fulfils its commitment to continue helping researchers push science and development forward. This is also reflected in the careful customisation of every system in order to meet the specific needs of every customer. From materials to life sciences or from engineering to the semiconductor industry, TESCAN guarantees high-per-formance systems without any compromises.
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