The creation of favorable conditions for the complex analysis of specimens, together with the possibility of high-quality images of the specimen surface for morphological studies, was a high priority in the design of TESCAN microscopes from the beginning of their development.
Transmission electron microscopy is widely used in the field of Life Science or Material Engineering. Therefore TESCAN has developed an adaptor that provides a complementary method for image acquisition of the transmitted electrons - scanning transmission electron microscopy detector (STEM).
High-efficiency SE detector is placed in the objective lens.
The new Rainbow CL detector with outstanding performance and 4x higher sensitivity compared to common CL detectors!
The Low Vacuum Secondary Electron TESCAN Detector is a unique solution developed and patented by TESCAN. A modified Everhart-Thornley design equipped with a YAG scintillator provides lots of merits.
TESCAN offers a SEM Control Panel as another option to the standard controllers like multipurpose trackball or EasySEM™ touch screen control interface.
Nanorobotics Manipulators are optional accessory expanding the TESCAN FIB and SEMs to a material processing and analytical Workbench.
AutoLoader - Automated Loading System for TIMA
With the newly developed Automated Loading System (AutoLoader), the TIMA has become the first automated mineral analyzer which permits robust, continuous and unattended sample loading. With the AutoLoader (robotics) system which allows accommodation of up to 100 epoxy blocks of 25mm or 30 mm diameter at one time, the TIMA has emerged as a powerful plant support instrument. It increases the sample throughput, minimizes manual labor and enables 24/7 operations.
The HADF R-STEM Detector (High Angle Dark Field Retractable STEM Detector) is a new retractable version of the fixed STEM detector.
The high quality of the cross-section surface is crucial, with no damage or artifacts. To be able to detect small structures, it is also important to stop FIB milling at the right time, by utilizing SEM observation during the cross-section polishing process.
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